| 摘要 |
PURPOSE:To increase the number of wafers to be contained in a sample stand, by inserting obliquely, into the sample stand, a plurality of pairs of wafer wherein two wafers are stacked back to back to constitute a pair, and installing a special closing member to prevent sliding-down, on a wafer inserting part of the sample stand, after the wafers are inserted. CONSTITUTION:A plurality of pairs of wafer 1 wherein two wafers are stacked back to back to constitute a pair are inserted into a sample stand 2 made of quartz, from a wafer inserting part 6, along each of the recessed type grooves 2g-2j of supporting columns 2a-2d of the sample stand 2 made of quartz. A plurality of pairs of wafer 1 are retained in the state inclining downward to some extent toward the wafer retaining side from the wafer inserting side, and the wafers 1 are stably accommodated in the sample stand 2 made of quartz. The upper end-portion of a closing member 3 is suspended by the hook of an upper side circular plate type member 2e of the sample stand 2 made of quartz, the closing member 3 closes the wafer inserting part 6 of the sample stand 2 made of quartz. Further it comes into contact with the peripheral part of the wafer 1 in the range not surrounded by the supporting columns 2a-2d, and prevents the wafer 1 from sliding down from the sample stand 2. Thereby, the number of wafers to be accommodated can be increased without changing the size of the main body of a semiconductor manufacturing equipment. |
