发明名称 COOLING DEVICE FOR FLAT SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To reduce pressure loss and to improve cooling efficiency, by winding a metallic rectangular pipe spirally from the center so as to shape it into a disk with a gap defined between adjacent pipe sections for providing a forward path for the cooling medium and interposing the disk between a pair of metallic plates so that a space surrounded by the adjacent pipe sections and the metallic plates provides a backward path. CONSTITUTION:A metallic rectangular pipe 10 having good heat conductivity is wound spirally from the center thereof such that a forward path 11 through which coolant 5 is refluxed is provided and that it forms a disk in which adjacent sections of the rectangular pipe 10 are spaced from each other by a gap. This spirally wound and disk-shaped rectangular pipe 10 is interposed between a pair of metallic plates 16 having good heat conductivity, so that the space surrounded by the adjacent sections of the rectangular pipe 10 and the metallic plates 16 provides a backward path 12. At least outermost section of the assembly is water welded 17 and lead members 9 are provided in connection with the forward and backward paths 11 and 12, respectively, for providing water supplying and exhausting orifices. Thereby, pressure loss can be reduced and a highly efficient cooling unit can be produced at a low cost.
申请公布号 JPS63308945(A) 申请公布日期 1988.12.16
申请号 JP19870144127 申请日期 1987.06.11
申请人 TOSHIBA CORP;AKUTORONIKUSU KK 发明人 MATSUMOTO HISAAKI;TATEISHI YORIO;AKACHI HISATERU
分类号 H01L23/473;H01L23/46 主分类号 H01L23/473
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