| 摘要 |
PURPOSE:To bond a substrate having a transparent electroconductive layer without causing damages and slide of the transparent electroconductive layer, by bonding the substrate to an adherend by high-frequency dielectric heating through an electroconductive filler-containing heat-sealing agent. CONSTITUTION:An electroconductive filler-containing heat-sealing agent is applied to a substrate having a transparent electroconductive layer. The coated substrate is laid on an adherend and subjected to high-frequency dielectric heating to effect sealing. Said substrate having a transparent electroconductive layer is formed by, for example, forming a thin film of indium oxide or indium tin oxide on a plastic film or sheet by, e.g., evaporation, sputtering or coating. It is suitable to use a filler formed by adding a powder of a metal such as Sn, Au, Pd, Ag, Ni or Cu or a carbon powder to a usual heat-sealing agent as said heat-sealing agent.
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