发明名称 WIRE BONDING EQUIPMENT
摘要 PURPOSE:To reduce the time for wire insertion work, and improve the efficiency of bonding work, by installing a microscope so as to face an inlet of the wire insertion hole of a wedge tool. CONSTITUTION:When a wire 11 is inserted into a wedge tool 23, a tip of the wire 11 supplied from a spool is firstly inserted into the wire inserting hole inlet 30 of the upper surface 26 of the wedge tool 23, and made to protrude from the wire inserting hole outlet 31 of a slanting surface 25. Next, while a second wire inserting hole inlet 32 is observed by a microscope 33, the wire is inserted into the second wire inserting hole inlet 32 of a vertical surface 24. The tip of the wire 11 is made to protrude from the second wire inserting hole outlet 34 arranged on the lower end part of the wedge tool. Thereby, the time for wire insertion work can be reduced, and the efficiency of bonding work can be improved.
申请公布号 JPS63308926(A) 申请公布日期 1988.12.16
申请号 JP19870144126 申请日期 1987.06.11
申请人 TOSHIBA CORP 发明人 WATANABE TAKAO;YONEZAWA MICHINARU
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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