发明名称 SOLDERING METHOD
摘要 PURPOSE:To improve the quality in soldering by detecting the laser reflection light emitted from a solder, deciding the molten state of the solder as well and controlling the radiation of the light based on the decided result thereof. CONSTITUTION:The xenon lamp 19 emitting a beam of light to a soldering place via the fiber 12 for light guide and the laser oscillator 13 leading the laser light to the creamy solder 9 are arranged together. Simultaneously with the light of the lamp 19 being radiated on the creamy solder 9 the laser light from the laser oscillator 13 is led to the solder 9. In this case, the laser reflection light is scattered until the solder 9 is melted but reflected to one direction on the solder surface after melting. This reflected laser light is detected by an photoelectric transducer 17 and a control circuit 30 judges the melting of the solder 9 and the input control of the light is executed by a shutter 23. The soldering quality is improved because of the under and over light radiation being prevented.
申请公布号 JPS63309370(A) 申请公布日期 1988.12.16
申请号 JP19870141381 申请日期 1987.06.08
申请人 USHIO INC 发明人 EHASHI NOBUTOSHI
分类号 B23K26/00;B23K1/005;H05K3/34 主分类号 B23K26/00
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