| 摘要 |
PURPOSE:To make it possible to simplify the equipment in assembling and inspecting processes, by incorporating a resistor heating body in a semiconducltor element package. CONSTITUTION:A resistor heating body 4 is formed at a part directly below an area 3, on which semiconductor element is to be mounted. Ceramic packages, which are presently used, have multilayer structures. Any resistor heating body can be used for the body 4 if it can withstand the manufacturing processes of the ceramic packages. When the terminal of the resistor heating body is connected to any of external leads 2, usage becomes easy. In the assembling process where above described packages are sued, a current is flowed through the resistor heating body and it is heated to a specified temperature, when at first the semiconductor element is dye-bonded. In the process of wire bonding, the temperature is increased by completely the same way as in the dye bonding process, as required. |
