| 摘要 |
PURPOSE:To obtain a fine circuit pattern by using paste which includes copper powder, whose average powder diameter and weight portion are specified, and S, Te and Se, whose weight portions are specified, when an electronic circuit parts are provided on a ceramics substrate and it is coated with conductive paste for film. CONSTITUTION:Circuit parts are coated with conductive paste which includes copper powder, whose average diameter is below 1mum, by 100 weight portion and at least one kind among S, Te and Se by 0.01-4 weight portion and flit glass as a binder. Hereupon, as the flit glass, the blending amount of borosilicate glass is determined as 2-7 portion by weight, and to make up a coat, for example, an alumina substrate of 0.8m is used as a substrate and a glazing layer of Si)2-Al2O3-ZnO-CaO line is coated thereon and the surface roughness is finished to 1mum at maximum in advance and then paste, which used 8 portion of acryl resin and 24 portion of organic solvent butyl albitole acetate as binder, is coated thereon and they are dried for 10 minutes at 120 deg.C to form a coat of 2-4mum in thickness. |
