发明名称 MASK PATTERN CORRECTING METHOD FOR X-RAY EXPOSURE
摘要 PURPOSE:To obtain a pattern correcting method which is effective when pattern deffects extend all over the mask pattern, by forming an X-ray resist film with a specified pattern by performing a trimming treatment after the X-ray resist film almost corresponding with a mask pattern to be corrected is formed. CONSTITUTION:An X-ray mask 1 to correct a mask pattern 4 is prepared, and a positive type resist film 5 sensitive to X-ray is spread thereon. After baking at a specified temperature, X-ray exposure on the whole surface is performed from the opposite surface to the adhered resist film 5. The X-ray resist film 5 subjected to the X-ray exposure is developed to eliminate the resist film of exposed part, and the whole remaining pattern of the X-ray resist film 5 is subjected to an additive trimming treatment. In the final process, unnecessary parts 4', 4' are eliminated by an etching treatment, and then the X-ray resist film 5 is eliminated by ashing and the like. As the result, the mask pattern 4 turns to a pattern of original desired width, and the shape correction for the mask pattern 4 is finished. Thereby, a pattern correcting method can be obtained.
申请公布号 JPS63308918(A) 申请公布日期 1988.12.16
申请号 JP19870145693 申请日期 1987.06.11
申请人 SANYO ELECTRIC CO LTD 发明人 INOUE TETSUHIRO
分类号 G03F1/00;H01L21/027;H01L21/30 主分类号 G03F1/00
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