| 摘要 |
PURPOSE:To prevent production of cracks in a ceramic substrate, by providing a groove around a chip carrying position of a heat dissipating bottom plate. CONSTITUTION:A heat dissipating bottom plate 4 is soldered, with a soldering material 3, on a metallized layer 2 provided on one face of a ceramic substrate 1 having a through hole at the center thereof, and a semiconductor chip 5 is attached to the part of the bottom plate 4 corresponding to the through hole of the substrate, by means of Au/Si eutectic crystals. A groove 11 is formed around this chip carrying part of the heat dissipating bottom plate 4, so that any stress caused by difference in thermal properties between the ceramic substrate 1 and the bottom plate 4 is concentrated to the groove 11 and, thereby, stress in the substrate 1 can be alleviated. Thus, it is possible to prevent cracks which otherwise would be produced along the periphery of the heat dissipating bottom plate.
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