发明名称 METHOD OF FORMING FERROELECTRIC THIN FILM
摘要 PURPOSE:To enable a ferroelectric thin film of the film quality having excellent insulating characteristic to be formed easily by giving the effect of annealing selectively to only the surface of a film under film formation without raising the substrate temperature. CONSTITUTION:In the process of forming a ferroelectric thin film by a sputtering method through causing a substrate 22 to pass over a plurality of targets 24, 25 periodically, the accumulation of film and the heat oxidation treatment are caused to proceed simultaneously by heating momentarily only the surface of a film being formed between the targets 24, 25 selectively by using an optical heating means, such as flash lamp 28. Accordingly, in the case, for example, of a substrate, on which a transparent metallic oxide film is formed in advance, the bonding strength between a constitutive metal atom under film formation and an oxygen atom can be improved without increasing the resistance of said transparent metallic oxide film. Thereby, a ferroelectric thin film of the film quality having excellent insulating characteristics can be obtained easily.
申请公布号 JPS63307606(A) 申请公布日期 1988.12.15
申请号 JP19870144435 申请日期 1987.06.09
申请人 FUJITSU LTD 发明人 HASEGAWA TADASHI;WATABE JUNICHI;KATAYAMA YOSHIROU;WAKITANI MASAYUKI;SATO KIYOTAKE
分类号 C23C14/08;C23C14/34;H01B3/00 主分类号 C23C14/08
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