Contacting of electronic components on printed circuit board - using wave soldering of unwired and wired components on surface pretreated with removable solder resist layer

摘要

The component side of the board is treated before attachment of conductorless (surface mount) components with a solder resist layer which covers the holes previously drilled for conventional wired components. Subsequently, the adhesively bonded surface mount components are put through a solder wave for contacting. The solder resist layer is then removed and the circuit board after placement of the wired components on the opposite side is subject to flux treatment and wave soldering on the connection side. This process may be program-controlled to allow for variable solderability of surface mount components. USE/ADVANTAGE - With mixt. of surface mount devices and wired components, both types can be connected in single conventional wave soldering operation without usual cleaning process.