发明名称 METHOD AND APPARATUS FOR ALIGNING WAFER
摘要 Method and apparatus are disclosed for prealigning the transport stage of an automated wafer handling lithographic system. The wafer is first rotated and its displacement in X, Y, and (-) from a desired orientation is determined. The wafer chuck of the transport stage is then displaced by a compensating amount.
申请公布号 JPS63308339(A) 申请公布日期 1988.12.15
申请号 JP19880026708 申请日期 1988.02.09
申请人 PERKIN ELMER CORP:THE 发明人 ORESUTO ENGERUBUREHITO
分类号 B65G49/07;H01L21/68 主分类号 B65G49/07
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