| 摘要 |
PURPOSE:To improve the adhesion of marks by applying laser radiation to the region of the seal part surface where marks are to be formed, and applying ink to form the marks. CONSTITUTION:Laser radiation 5E is applied by a laser device 5 to the region of the surface of a resin sealing part 2a of an individual resin sealed semiconductor device 2A of a group of semiconductor devices 2 where marks are to be formed. This laser radiation 5E is applied so as to burn the surface of the resin sealing part 2a, cutting and activating the chemical bonding chains on the surface of the resin sealing part 2a. Then, ink is applied by an ink mark device to the mark formation region of the resin sealing part 2a surface exposed to the laser radiation 5E, forming marks 2C. With this, the adhesion of the marks 2C can be enhanced.
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