| 摘要 |
PURPOSE:To prevent crosstalk without increasing the number of processes or complicating the processes by forming the wirings of a superconductive material. CONSTITUTION:In the integraded circuit package wherein the wiring pitch of the part having the maximum density is three times the line width or less and the wirings adjoining the signal lines are not signal lines, the wirings are formed of a superconductive material. As the superconductor to be used, a composite oxide of the Y-Ba-Cu-O system is preferred. Because, by a composite oxide of the Y-Ba-Cu-O system, the highest Tc can be expected up to the pres ent time, and if any other superconductive material of a high Tc is found or invented, it is preferably used. With this, a small-sized package for a high- density, high-speed and high-frequency integrated circuit is obtained in which no crosstalk occurs.
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