| 摘要 |
PURPOSE:To provide a polymer composition especially suitable for the coating and/or sealing of a semiconductor element, by using a specific ether imide compound and, if necessary, a polyfunctional epoxy compound as a component. CONSTITUTION:A polymer composition suitable for the coating and/or sealing of a semiconductor element can be produced by using (A) an ether imide compound of formula III produced by reacting an amine compound having an ether bond and expressed by formula I (R1-R4 are H, lower alkyl, lower alkoxy, etc.; R5 and R6 are H, methyl, ethyl, etc.; X is NH2, NH, CN, etc.) with an ethylenic unsaturated dicarboxylic acid anhydride of formula II (D is 2-24C bivalent organic group) as an essential component and, if necessary, compounding the component A with (B) a polyfunctional epoxy compound (e.g. triglycidyl ether of glycerol). Preferably, the composition is further compounded with an ether imide compound of formula IV to improve the heat-resistance and optionally added with triallyl cyanurate, etc.
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