| 摘要 |
<p>PURPOSE:To obtain a hybrid integrated circuit and a hybrid integrated circuit device, the degree of integration of which can be improved and which be miniaturized, by using a shape memory alloy as a wire. CONSTITUTION:A hybrid integrated circuit consists of a plurality of elements 2, 4, 5 and wires 3 connecting the elements 2, 4, and the wires 3 are composed of a shape memory alloy. One ends of wires 3a memorized to a specified shape are connected to one side 2 of an element to which the wires 3a are connected, the wires 3a are heated at a transformation temperature or more and recovered to the memorized shape, and the other ends of the wires 3, shapes of which are recovered, are connected to the other elements 4. Accordingly, a hybrid integrated circuit and a hybrid integrated circuit device, which are manufactured while a wire holding mechanism is unnecessitated, can be connected at a time when connecting sections are brought to a multipolar state and are miniaturized, are acquired.</p> |
