| 摘要 |
PURPOSE:To inspect automatically and stably whether or not a chip component on a high-density package board is soldered normally by projecting slit light on the soldering part of the chip component of the printed board slantingly and receiving and fetching its reflected light to a video memory. CONSTITUTION:The chip component on the board 1 to be mounted which is placed on an XY table and the soldering part 3 are radiated by a slit light source 4 in an about 60 deg. slanting direction, and their images are inputted to the video memory 6 by the video camera 5 which is fitted slantingly as well and light-receives the reflected light from the board 1. Then the soldering state of the component is decided from reflection images from the board 1 and the states of discontinuous parts D' between reflection images from the chip components 2.
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