| 发明名称 |
HEAT SINK STRUCTURE FOR AN ELECTRONIC PACKAGE |
| 摘要 |
A heat sink structure for mounting on a semiconductor package includes a plurality of pins (20) affixed to a lid on the package (12-16), and a cooling fin means (26) having a thin walled, cellular configuration with the cells defining parallel elongated openings that extend through the fin means. The pins (20) are seated in the cells of the fin means. |
| 申请公布号 |
DE3475142(D1) |
申请公布日期 |
1988.12.15 |
| 申请号 |
DE19843475142 |
申请日期 |
1984.05.23 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HULTMARK, ERIC BRUCE;METREAUD, CLAUDE GEORGES;YACAVONIS, ROBERT ANTHONY |
| 分类号 |
H01L23/36;H01L23/367;H01L23/40;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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