| 摘要 |
PURPOSE:To enable a back gate bias to be stable by a method wherein a chip is turned over so as to be mounted on a semiconductor substrate after the chip is mounted on a conductive substrate and the rear of the conductive substrate is electrically connected with the inner pad of the semiconductor substrate or a package. CONSTITUTION:A semiconductor device is composed of components containing a substrate mounting region provided on the central section of a surface and plural inner pads 8 and 8a of printed wiring provided on the periphery of the substrate mounting region, a package 1 with plural pins 10 which protrude outward from the rear of it and are electrically connected with the inner pins 8 and 8a, a semiconductor substrate 2 fixed to the substrate mounting region, a chip 3 which is mounted on the semiconductor substrate 2 so as to contact the substrate 2 with its surface on which an IC is formed, a conductive substrate 4 fixed to the rear of the chip 3, and a wiring 9 connected with the pins chosen out of the pins 10. That is, the rear of the conductive substrate 4 and the pins 10a are electrically connected and a prescribed potential is applied to the pins 10a so that the conductive substrate 4 is kept uniform in potential and the substrate potential of the chip 3 can be made to be stable. Thus, a back gate bias can be kept stable. |
