| 摘要 |
PURPOSE:To make it possible to form solder bumps securely and at a low cost by placing a board on which solder chips are mounted upon a circuit substrate, said board having throughholes formed opposite to the parts of the circuit substrate where the solder bumps are to be formed, and after concurrently putting the solder chips into a plurality of throughholes respectively, causing the solder chips to fuse. CONSTITUTION:A board 5 on which solder chips are mounted is placed upon a circuit substrate 1, said board 5 having throughholes 6 formed opposite to the parts 2 of the circuit substrate 1 where solder bumps are to be formed. And all the solder chips 10 opposed to the respective ones of the plurality of throughholes 6 and formed from a solder sheet 7 are concurrently dropped, and the board 5 on which the solder chips are mounted and the circuit substrate 1 are heated to a temperature at which the solder is fused, thereby fusing the solder chips 10 to the circuit substrate 1. With this, the putting in of the solder chips 10 becomes reliable and the automatization thereof becomes possible.
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