发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To improve the utilization efficiency of a target for sputtering and the uniformity of thickness of a formed film by fitting the target to a cathode, placing a looped beltlike magnet having alternately arranged N and S poles at prescribed intervals on the rear side of the cathode and moving the magnet at a constant speed. CONSTITUTION:A target 12 for sputtering is fitted to a cathode 13 in a vacuum chamber 11 so that it confronts a substrate 16 on which a film is to be formed, fitted to a substrate holder 17. A looped beltlike magnet 14 having alternately arranged N and S poles at prescribed intervals is placed on the rear side of the cathode 13 so that the S and N poles are positioned perpendicularly to the moving direction 21 of the magnet 14. The magnet 14 is moved at a constant speed and sputtering is carried out as usual. Thus, the utilization efficiency of the target 12 is improved and a film of a uniform thickness is formed on the substrate 16.
申请公布号 JPS63307270(A) 申请公布日期 1988.12.14
申请号 JP19870142636 申请日期 1987.06.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSUDA YOSHIYUKI;SHINTAKU HIDENOBU
分类号 C23C14/36;C23C14/35 主分类号 C23C14/36
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