| 摘要 |
PURPOSE:To eliminate the inflow process of light shielding resin and prevent mis-operation due to noise by covering region on substrate opposing to the specified region of bottom surface of LSI chip to be bonded with a material used for forming electrode pattern on said substrate. CONSTITUTION:Since a grounding electrode pattern 7 consisting of not-transparent conductive material is extendingly formed on the region 8 on which a light shielding resin of substrate 1 is to be flowed in, light can be shielded. Therefore, after an LSI chip is bonded to an electrode pattern 2, it is no longer necessary to supply the light shielding resin into a narrow gap between them. Namely, the LSI chip can immediately be sealed with the potting resin after the bonding. Moreover, since the bottom part of LSI chip is covered with a conductive film provided on the region 8, namely with the grounding electrode pattern 7, influence of noise can be prevented and cause of misoperation of LSI can be eliminated. |
