发明名称 MULTILAYERED PRINTED BOARD
摘要 PURPOSE:To perform a ready-made multilayered printed wiring by a method wherein printed boards whose inside layer is wired with certain pattern are used as a semi-completed multilayered printed board. CONSTITUTION:The thin solid line indicates a circuit on the first layer, the thin broken line indicates circuit using a second layer by-pass wiring channel, the thick hatched line slanting in the left side direction indicates the 5th layer by-pass wiring channel, and the hatched thick line slanting in the right side direction indicates the 6th layer by-pass wiring channel. Although the first layer conductor channel disappears at the conduction hole 24, the circuit entering from the left direction is connected to the conduction hole 5 in the direction of right side via the second layer by-pass, appears on the first layer through a conduction hole 26 and connected to the channels is the longitudinal direction. Thus, many kinds of electric circuits are formed of printed wirings using ready- made multilayered printed boards.
申请公布号 JPS63306692(A) 申请公布日期 1988.12.14
申请号 JP19870142734 申请日期 1987.06.08
申请人 KUWANA GIKEN KK 发明人 MORIKAWA SUMIO
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址