| 摘要 |
A hybrid integrated circuit device comprises a metal substrate (31), a casing member (32) and external leads (33). An insulting film (34) is formed on the metal substrate (31), conductive paths (35) are formed on the insulating film (34), circuit elements (38) are connected to the conductive paths (35), and conductive pads (36) are formed in the tip portions of the conductive paths (35). The casing member (32) comprises a sealing portion (39) surrounding the circuit elements (38) and a connector portion (37) projected from the bottom portion (391) of the sealing portion (39) and extending beyond an end of the metal substrate (31), and formed of insulating resin. Each of the external leads (33) has one end connected to each of the conductive pads (36) and supported by the side surface of the connector portion (37). |
