发明名称 POLISHING DEVICE
摘要 PURPOSE:To well polish a surface of plane and curved shape by providing a control system which is to control the position of a polishing tool, so that a pressure of abrasive grain fluid in the polishing tool determined corresponding to a size of clearance between the polishing tool and its polishing surface is generated to a fixed value, further the tilt of a workpiece. CONSTITUTION:A polishing device, switching an abrasive fluid supply selector valve 20 to a contactless polishing side, contactlessly polishes a surface of a metal mold 4 by allowing abrasive grain fluid 13 to pass through a hole 12 in a polishing tool 6 via a pump 14 and a pipe 15 and in a clearance 24 between the polishing tool 6 and the metal mold (workpiece) 4 in a high speed. In the time of this contactless polishing, a pressure, determined corresponding to a size of this clearance 24, of the abrasive grain fluid 13 in the polishing tool 6 is detected by a pressure detector 16. Inputting this detected value to a clearance control unit 17 to be compared with the preset value in its comparator circuit, in accordance with that compared result, the polishing device, which drives a servomotor 19 vertically moving the polishing tool 6, sets the pressure, that is, the clearance 24 to the preset value while the polished surface horizontal for the polishing tool 6 by controlling a tilt angle of the metal mold 4 with a control unit 21.
申请公布号 JPS63306870(A) 申请公布日期 1988.12.14
申请号 JP19870143076 申请日期 1987.06.10
申请人 HITACHI LTD 发明人 OKU TSUNEO;NOTO KOICHI
分类号 B24B17/10;B24B17/00;B24B37/005;B24B57/02 主分类号 B24B17/10
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