| 摘要 |
PURPOSE:To make the thickness of a piezoelectric oscillator thin by inserting a piezoelectric vibrator to a recessed part of a resin packaging of a semiconductor device and fixing a lead terminal of the semiconductor device and the external lead electrode of the piezoelectric vibrator. CONSTITUTION:A semiconductor element chip 8 incorporated with at least an oscillation circuit function is placed on a die pad 7, wire bonding connection is applied to a lead terminal 10 by an Au wire 9 and a projection is provided in advance so as to form a recessed part 16 to a packaging outer circumference face 15 at the opposite side with the semiconductor element chip 8, the die pad 7 or the lead terminal clipped inbetween. The lead wire as two external lead electrodes of the crystal vibrator 6 is welded to the shoulder where the lead terminal approaches the outer side face of the transfer mold resin 13, the lead wire 4 is bent twice to insert the crystal vibrator 6 into the recessed part 16 of the semiconductor device 14 to constitute the crystal oscillator.
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