| 摘要 |
<p>PURPOSE:To prevent the deformation and damage of a lead member mounted at approximately a right angle to a package base during the transportation of the package base by connecting lead members by joints. CONSTITUTION:A flange section 9 for a lead section 8 is brazed to a flat land formed to the rear of a package base 3. Since the brazing differs from the formation of each lead section 8 onto the flat lands and can be conducted at a time, a process is simplified, and cost is reduced. Since the lead section 8 is connected by a connecting section 12 and a central connecting section 14 and formed to an integral shape, strength is increased, thus preventing deformation and damage during transportation to the next process. A semiconductor element 2 is die-bonded into a recessed section 4 at the central section of the package base 3, and semiconductor-element side bonding pads and package-base side bonding pads are connected by bonding wires 7. Accordingly, the deformation and damage of outer leads are prevented.</p> |
