| 摘要 |
PURPOSE:To obtain a semiconductor device capable of coping with the increase of density and pins and having excellent productivity by mounting a semiconductor element housed in a recessed section in an insulating substrate with an outer lead, an insulating supporter covering the surface of the insulating substrate and a plurality of conductor wirings. CONSTITUTION:Each electrode pad section 10 for semiconductor elements 5 is joined collectively with bump sections 11 at one ends of each conductor wiring 8 supported by an insulating supporter 9 at a time, the semiconductor elements 5 are housed into recessed sections 7 in the surface of a substrate as the semiconductor elements 5 are left as they are, and the other ends of the conductor wirings 8 are connected respectively to viaholes 2 on corresponding outer leads 4. Since the conductor wirings 8 are extended onto the semiconductor elements 5 and connected to electrodes, excess space can be omitted in the peripheries of the semiconductor elements 5, the electrodes can be disposed to sections near the centers if the surface of the semiconductor elements 5, and packaging density can further be increased. One ends of all conductor wirings 8 and all electrodes for the semiconductor elements 5 can be connected collectively at a time. Accordingly, productivity is improved, and a semiconductor device can be acquired at low cost.
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