| 摘要 |
PURPOSE:To improve the thermal conductivity of a resin die bonding material, and to obtain reliability not deteriorated thermally even to an IC chip consuming large currents by using non-oxide group fine ceramics fines or fines consisting of these mixture as the fillers of the resin die bonding material. CONSTITUTION:In a semiconductor device constituted by die-bonding and fixing a semiconductor chip 1 to an island section 2 of a lead frame by a resin die bonding material 3, non-oxide fine ceramic powders are employed as the fillers of the resin die bonding material 3. Since these fillers have extremely large thermal conductivity, heat generated at the time of the operation of the semiconductor device can be dissipated excellently to the lead frame side through the resin die bonding material. Accordingly, the thermal conductivity of resin die bonding material itself is improved, and heat generated at the time of the operation of an IC chip consuming large currents can be dissipated superiorly to the lead frame side even on the IC chip, thus enhancing the thermal reliability of the device. |
