| 摘要 |
<p>Organic dielectrics are subjected to a number of demands. The novel process facilitates the preparation of organic dielectrics on a substrate, the dielectrics having high temperature resistance, good electrical properties, alkali resistance, low moisture absorption and high purity. …<??>According to the invention, an oligomeric and/or polymeric hydroxypolyamide, dissolved in an organic solvent, is applied to the substrate, the solvent is removed, and the hydroxypolyamide is converted into a polybenzoxazole by conditioning at a temperature between 200 and 500 DEG C.</p> |
