| 摘要 |
PURPOSE:To enable the use of a high-quality and high-viscosity resin, and to obtain a sealed part of high reliability by setting up a package made of a synthetic resin with an opening section for receiving an element to a lead frame, bonding the element into the opening section and sealing the opening section with a sealing cover. CONSTITUTION:The resin enclosing section of the surface of the frame 1 made of a metal is roughened previously by using chromic acid, etc. in order to improve adhesive property, and a package 7 consisting of an epoxy resin, an unsaturated polyester resin, a phenol resin, etc. is fixed to the back of the frame. The package 7 made of the same material with the opening section 6 for receiving the element is fastened opposed to the package 7 while holding the frame 1, and the semiconductor element 2 is bonded with the central section of the frame 1 exposed in the opening section 6. The electrode of the element 2 and the frame 1 are connected by inner bondings 3 by utilizing holes formed to the frame 1, and the opening surface of the opening section 6 is clogged by the sealing cover 8. |
