| 发明名称 |
Process for producing printed wiring board |
| 摘要 |
A base board having a plurality of semicircular through-holes filled with solder at side walls produced by filling through-holes with solder can be connected electrically to printed circuit boards with large connecting strength and high reliability.
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| 申请公布号 |
US4790894(A) |
申请公布日期 |
1988.12.13 |
| 申请号 |
US19870046515 |
申请日期 |
1987.05.06 |
| 申请人 |
HITACHI CONDENSER CO., LTD. |
发明人 |
HOMMA, MASAJI;YAMAUCHI, HITOSHI |
| 分类号 |
H01L23/14;H01L23/498;H05K1/03;H05K1/14;H05K3/00;H05K3/34;H05K3/40;H05K3/42;(IPC1-7):B32B31/00;B23K31/02;B23P17/00 |
主分类号 |
H01L23/14 |
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代理人 |
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