| 摘要 |
PURPOSE:To prevent the falling and adhesion of dust to a semiconductor substrate when the semiconductor substrate is extracted, and to shorten workhours for extracting the semiconductor substrate by giving a connecting board elasticity and bringing the connecting board to a movable state. CONSTITUTION:In an equipment having a pair of side plates 1, to inner surfaces of which a plurality of groove sections housing semiconductor substrates are formed oppositely, and connecting members 4 respectively connecting both end sections of a pair of the side plates 1, one parts or the wholes of the connecting members 4 have elasticity. Before the semiconductor substrates are taken out of the semiconductor substrate cassette housing the semiconductor substrates, elastic force applied to connecting boards is removed by applying pressure to collars 3 in the semiconductor cassette or the upper sections of the side plates 1, and the semiconductor substrates 5 can be extracted from the underside of the semiconductor substrate cassette. Accordingly, falling and adhesion of dust to the semiconductor substrates by extraction from the cassette are prevented, and workhours at the time of extraction are shortened. |
