| 摘要 |
PURPOSE:To enhance the copper foil release resistant strength of a printed wiring board, by preparing varnish by compounding an inorg. acid salt of aliphatic amine, a solvent and an epoxy resin and treating a copper foil with said varnish. CONSTITUTION:An inorg. acid salt of aliphatic amine, a solvent and an epoxy resin are compounded to prepare varnish. Subsequently, a copper foil is immersed in the varnish at about 20-50 deg.C and the varnish is dried at 80-200 deg.C using a drying oven. The concn. of the inorg. acid salt of aliphatic amine compounded with the varnish is pref. 0.001-10wt.%. As the solvent of the varnish, there are acetone, toluene, xylene or the like and the compounding amount of the epoxy resin to the solvent is pref. 0.01-50% by wt. of the solvent. When this treatment method is appalied, the bonding force of the copper foil of a copper clad board, especially, the adhesive force after hydrochloric acid treatment thereof is enhanced.
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