发明名称 METHOD FOR CURING HEAT-CURING FILM
摘要 PURPOSE:To improve heat efficiency and temp. distribution, by a method wherein a releasable resin layer is formed on the uncured film provided to the surface of a base material and subsequently heated by steam or hot water to cure the uncured film before the releasable resin layer is released. CONSTITUTION:An uncured heat-curing film is formed on the surface of a base material and, after drying, a layer composed of a releasable resin is formed on said film. Subsequently, the uncured film is heated by steam or hot water to be cured and, thereafter, the releasable resin layer is released. The aforementioned heat-curing film is formed by applying a phenol resin or epoxy/phenol resin. As the releasable resin, there is a vinyl chloride/vinyl acetate copolymer. By this method, a water penetrating layer can be perfectly prevented from being formed on the surface layer of the heat-curing film by steam or hot water.
申请公布号 JPS63305966(A) 申请公布日期 1988.12.13
申请号 JP19870141501 申请日期 1987.06.08
申请人 CHIYODA CHEM ENG & CONSTR CO LTD 发明人 AOKI SHIGERU;TOMIKAWA MIZUKADO;TOKARI OSAMU
分类号 B05D3/02 主分类号 B05D3/02
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