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发明名称
Device for bonding of lead wires for an integrated circuit device
摘要
申请公布号
US4790897(A)
申请公布日期
1988.12.13
申请号
US19870043894
申请日期
1987.04.29
申请人
LSI LOGIC CORPORATION
发明人
LONG, JON
分类号
H01L21/60;H01L21/00;H01L21/607;(IPC1-7):B32B31/26
主分类号
H01L21/60
代理机构
代理人
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