发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To easily obtain a cured material which has the excellent sensitivity and no amine odor and the sufficient mechanical strength by exposing for a short period, by incorporating an amide compd. having a specified structure with a prescribed ratio together with a photopolymerization initiator in the titled material. CONSTITUTION:The titled composition contains the amide compd. shown by formula I and the photopolymerization initiator, and said amide compd. is necessary to be incorporated in the titled composition in an amount of >=5wt.% of the compd. based on the total weight of the titled composition. In the case that the additional mount of the compd. is about 3wt.%, the sensitivity of the titled composition somewhat increases, but, the sufficient effect is not obtd., in the reduction of an exposure time and the formation on a relief such as a minimum point, etc. The compounding amount of the photopolymerization initiator is usually 0.001-10wt.% based on the total weight of the titled composition. Thus, the cured material which has no amine order the excellent sensitivity measured based on insolubility of the cured material, and the excellent sensitivity measured based on the mechanical strength and the hardness is obtd.
申请公布号 JPS63305346(A) 申请公布日期 1988.12.13
申请号 JP19870140890 申请日期 1987.06.05
申请人 ASAHI CHEM IND CO LTD 发明人 TAKAHASHI MOTOAKI;USUBUCHI MINORU
分类号 G03F7/027 主分类号 G03F7/027
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