| 摘要 |
PURPOSE:To save the area of mounting, and to enable exchange easily by bringing one edge section of a connector pin arranged inside a guide member and an electrode for a chip carrier substrate into contact and connecting the other edge of a connector pin disposed outside the guide member with an electrode pattern for an electronic circuit substrate. CONSTITUTION:A chip carrier 4 is formed by a chip carrier substrate 1, a bare chip 3, etc. An IC socket with a guide member 8 is surface-mounted onto an electrode pattern for an electronic circuit substrate 12 by solder 12a. The chip carrier substrate 1 receives the pressure of connector pins 9, and is fixed among the connector pins 9 and contacting members 7. Since there are clearances 11 among the guide members 8 and the chip carrier substrate, the substrate can be set up or dismantled to or from a socket easily by sliding the chip carrier substrate 1. Accordingly, the area of mounting is saved, and an IC can be fixed and mounted in an exchabgeable manner.
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