| 摘要 |
PURPOSE:To automatically inspect whether wire bonding height satisfies a prescribed value or not, by radiating the light beam to a wire rise part of a semiconductor chip being an object to be inspected, from the all circumferential direction, and bringing its part to an image pickup by an image pickup element. CONSTITUTION:An IC chip 2 is placed on an XYtheta moving mechanism 10, and thereafter, a moving mechanism 10 is driven by a controller 9, and its position is set so that the illuminating light of an illuminating equipment 11 is radiated to the rise part of a wire 4 of the IC chip 2 from the all-around direction. In such a state, a focus of an image pickup device 12 is adjusted to the rise part of the wire 4. The rise part is brightened strongly by said illumination, therefore, the rise part is brought to an image pickup as a bright image by the image pickup element 12. The image which is brought to an image pickup is digitized by an A/D converting circuit 13, thereafter, stored in an image memory 14. A height inspecting circuit 15 derives height of the wire rise part, based on said image data, and when the height is below a prescribed value, it is decided that wire bonding is not executed normally, and an alarm 16 is driven. |
