发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the bonding resin failure such as protruding, and improve the bonding strength, by fixing a ceramic substrate on the satin finished surface of a heat sink which is selectively subjected to a satin processing. CONSTITUTION:After the whole part of a heat sink 1 except a part 3 where a ceramic substrate is to be fixed is masked with a photoresist or the like, particles such as corundum are made to collide with the heat sink 1. Thereby, only the part 3 of the heat sink 1 where the ceramic substrate is to be fixed is subjected to a satin processing. By exfoliating the photoresist or the like, a satin finished part 4 is obtained, and thereon the ceramic substrate 2 is fixed with resin. Thereby, the resin is prevented from spreading to unnecessary parts, and the adhesion of resin is improved.
申请公布号 JPS63304651(A) 申请公布日期 1988.12.12
申请号 JP19870140235 申请日期 1987.06.03
申请人 NEC CORP 发明人 SHIMODAIRA SADAO;MIYAKI SHOJI
分类号 H01L23/36 主分类号 H01L23/36
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