| 摘要 |
PURPOSE:To obtain the titled epoxy polymer composition suitable for the bonding of metallic foils of printed circuit board with each other, metallic foil and synthetic polymer film, etc., by dispersing a specific powdery condensation reaction product in an organic solvent solution containing three specific kinds of solutes. CONSTITUTION:The objective adhesive composition enabling bonding at a low temperature in a short time can be produced by preparing an organic solvent solution containing (A) a compound having diglycidylamino group (e.g. tetraglycidylaminodiphenylmethane of formula), (B) an epoxy polymer (preferably a brominated bisphenol-type epoxy polymer having a bromination degree of >=18wt.%, etc.) and (C) an elastomer having a functional group reactive with epoxy group (preferably epoxy group or carboxyl group) and dispersing (D) a powdery condensation reaction product of an epoxy group-containing compound (e.g. the component A or B) with an amine compound (e.g. guanidine) or an imidazole compound in the above organic solvent solution.
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