| 摘要 |
PURPOSE:To enable Cu-S plating by electrodeposition from an aq. soln. as a plating soln. by providing a compsn. contg. copper (I) chloride, sodium thiosulfate and sodium hydrogensulfite as essential components to the aq. soln. CONSTITUTION:When electric current is supplied to a body to be plated in a plating soln. to plate the body by electrodeposition, an aq. soln. contg. copper (I) chloride, sodium thiosulfate and sodium hydrogensulfite as essential components in used as the plating soln. Constant electric current is preferably supplied at about 500A/m<2> current density. Thus, Cu-S plating having >=about 1atom.% S content can be formed by electrodeposition.
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