| 摘要 |
PURPOSE:To improve the flow of a resin in a syringe, and to inhibit the blowoff of air from the tip of a needle for the syringe while shortening the heating time after the resin is applied by providing a precoating head with a heating means elevating the temperature of the resin in the syringe. CONSTITUTION:A plurality of syringes 6 applying a resin 5 and a precoating head 9 holding the syringes 6 and moving the tips 7 of the syringes to the positions of, application are mounted to a device applying the resin 5 from the upper sections of wire-bonded semiconductor chips 1 on substrates 2 on a carrier 3, on which a plural ity of the substrates are loaded, on a carrying stage 4. The precoating head 9 is provided with a heating means 10 elevating the temperature of the resin 5 in the syringes 6. The tips of the syringe needles 7 are shifted to specified positions on the semiconductor chips 1 by the precoating head 9, air is fed into the syringes 6 from air pipes 8, the resin 5, the temperature of which is raised by the heat block 10 set up to the precoating head 9, is pushed, and the resin 5 is discharged from the tips of the syringe needles 7.
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