| 摘要 |
PURPOSE:To inhibit the expansion and contraction of an insulating resin due to a temperature change, and to obtain molding structure, in which there is no cracking in an IC chip and disconnection, by mounting a sheet metal taking an external shape larger than an opening section in an insulating plate and consisting of a material having a thermal expansion coefficient lower than that of the insulating resin on the active surface side of a semiconductor element to a shape that the insulating resin is held. CONSTITUTION:A sheet metal 9 taking an external shape larger than an opening section 7 in an insulating plate 8 composed of a resin, etc., and made up of a material having a thermal expansion coefficient lower than that of an insulating resin 4 is set up on the active surface 5 side of a semiconductor element 1 to a shape that said insulating resin 4 is held in a semiconductor device in which at least an active surface 5 in the semiconductor element 1 inner-lead bonded with conductor leads 3 protruded into said opening section 7 and the insulating plate 8 in the periphery of said opening section 7 are molded with said insulating resin 4. Said structure is formed in such a manner that the insulating resin 4 is applied to the IC chip 1 and the periphery of the IC chip 1 by printing or discharge by a dispenser from the active surface 5 side of the IC chip, the sheet metal 9 is placed and pressed lightly and the insulating resin 4 is heated and cubed.
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