| 摘要 |
PURPOSE:To form a multilayered film improved in the adhesive strength between thin dissimilar films, by successively vapor-depositing a thin film as first layer consisting of the primary material, a thin film as intermediate layer consisting of the primary and the secondary material, and a thin film as second layer consisting of the secondary material onto the surface of a substrate. CONSTITUTION:At the time of forming a multilayered film consisting of materials of plural kinds on the surface of a substrate (glass, etc.) by a physical thin film-forming method (vacuum vapor deposition method, etc.), the film formation is started by forming a first layer 2 by using the primary material (e.g., ITO) as an evaporation source. Subsequently, the amount of evaporation of the primary material is gradually reduced and the amount of evaporation of the secondary material (e.g., alumina) is gradually increased to form an intermediate layer 3 (about 0.01-0.2mu film thickness) consisting of the primary and the secondary material. Further, a second layer 4 is formed by using the secondary material as an evaporation source, so that a multilayered film is formed on a substrate 1. By this method, the adhesive strength between the first and the second layers 2, 4 is improved, and the multilayered film excellent in mechanical strength can be easily formed. |
