IC package for high-speed semiconductor integrated circuit device.

摘要

A tape-automated bonding substrate or TAB substrate (10) used for mounting a gallium arsenide IC chip (14) having external connection terminals including signal input and output terminals thereon is disclosed. Conductive thin-film wiring lines (24a, 24b) are formed on an insulative thin-film layer (16). These thin-film wiring lines include feed-through type signal input wiring lines (24a, 24b) to be connected to the input . terminals of the chip. Each feed-through type signal input wiring line has an inner lead (22) to which a corresponding signal input terminal of the chip is directly connected, a terminal pad for receiving a high-speed input signal, and a terminal pad to which an impedance-matching resistor (R) is to be connected. The feed-through type signal input wiring lines (24a, 24b) have a composite line structure of micro-strip signal transmission and co-planar signal transmission line structures.