PROCESS FOR MANUFACTURING COPPER-CLAD LAMINATE

摘要

The process comprises (i) introducing rolled copper foil through a power supply/guide roller into an electrolyte and passing it between parallel electrodes to form an etched layer on the surface of the foil, (ii) applying adhesive to the etched layer; and (iii) pressing the foil onto a synthetic resinimpregnated substrate to form a copper-clad laminate. The laminate is used as a printed circuit board. By electrochemically etching the foil instead of oxidising, strong adhesion is obtd. between the foil and the substrate. The absence of copper oxide particles in the substrate reduces the time required for pattern etching, improving the high frequency response of the resulting circuit.