| 发明名称 |
Photopolymerizable composition. |
| 摘要 |
<p>A photopolymerizable composition comprising (a) an addition polymerizable compound having a boiling point of 100 DEG C or high under an atmospheric pressure, (b) a photoinitiator, and (c) a benzene derivative can provide a cured film having high strength suitable for producing, e.g. printed circuit boards.</p> |
| 申请公布号 |
EP0294220(A2) |
申请公布日期 |
1988.12.07 |
| 申请号 |
EP19880305088 |
申请日期 |
1988.06.03 |
| 申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
KAJI, MAKOTO;HAYASHI, NOBUYUKI;KANEKO, FUTAMI |
| 分类号 |
G03F7/027 |
主分类号 |
G03F7/027 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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