| 摘要 |
PURPOSE:To enhance the mass productivity, working efficiency and reliability by a method wherein a conductive connection is executed by a thermal pressure method while a circuit substrate and a connection wiring board are sucked and fixed temporarily by a sucking force of the air via a vent hole and a hole part. CONSTITUTION:A circuit substrate 1 has conductive connection terminals 1b which have been formed collectively together with wiring patterns by using a conductive material such as a sheet of copper foil or the like; a connection wiring board 2 has connection terminals 2b which have been formed by the conductive material. The circuit substrate 1 is placed on a board-fixing sheet 3 having vent holes 3a which are connected to a thermal pressure machine; it is set while the connection wiring board 2 is being aligned with the surface of the circuit substrate 1. During this process, the circuit substrate 1 and the connection wiring board 2 are sucked and fixed to the board-fixing sheet 3 by a sucking force f of the air via the vent holes 3a and a hole part 1c which has been formed in the circuit substrate 1; the suction and the fixation are operative even when a thermal pressure operation is completed and a thermal pressure head 4 attached to the thermal pressure machine is detached from the connection wiring board 2. The connection wiring board 2 is fixed temporarily when it has been set; it is not dislocated or floated until the thermal pressure operation is completed.
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