| 摘要 |
PURPOSE:To perform a reduction in the stress of a sealing resin, further improving its moisture resistance and reliability, by covering the surface of silica with a covering layer mainly containing specific silicone and epoxy resin to form a silicone modified silica, and using it. CONSTITUTION:Silicone modified silica composed of epoxy resin, phenol resin, and silica, silane coupling agent, organopolysiloxane having at least one primary or secondary amino group in a molecule, and epoxy compound represented by general formula (l) or (II) is used as a material. A semiconductor element is sealed with the epoxy resin composition containing these components. Its internal stress can be reduce by this sealing, its moisture resistance can be largely improved, and reliability can be remarkably enhanced. However, in the formulas (I), (II), R1, R3 are 12 or less C alkylene group, R2 is alkyl group or aryl group, l is 0 or 1, and m, n are integer numbers of 2 or larger.
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